Realme 3 to Have Diamond Back Design, Helio P70 Processor

It will launch very soon

After teasing the Realme 3 a few days back, Realme just revealed more details about the upcoming phone. To kick things off, they have confirmed that the Realme 3 will have the diamond-cut design of the original Realme, along with a vertically-stacked dual rear camera setup.

As for the internals, Realme CEO Madhav Sheth confirmed that the Realme 3 will use an Helio P70 processor, making it the second Realme phone to use MediaTek’s mid-range processor. Compared to the Helio P60, the Helio P70 has a higher clock speed and claims to be more power-efficient than its predecessor.

There are no release details yet, but given that Samsung’s Galaxy M30 will launch on February 27 and Redmi will unveil the Redmi Note 7 Pro on February 28, expect Realme to unveil the Realme 3 sometime in March.


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