Mobile World Congress is coming up in about two weeks, and as expected leaks for highly anticipated phones have become more regular as the show nears. One of the phones that is expected to make an appearance during MWC is Huawei’s P10 Plus, the company’s follow-up to their highly regarded dual-camera, Leica co-engineered P9.
A new leaked promotional render of the P10 Plus has leaked which shows off the phone in its entirety. The phone still has that dual-camera setup that’s been co-engineered with German camera brand Leica, but the phone now shows off a stunning curved sides. While there are reports that the smaller P10 will have the fingerprint sensor on the front, the P10 Plus has its fingerprint sensor mounted on the rear, just like last year.
The P10 Plus is expected to come equipped with a 5.5-inch QHD panel, a Kirin 960 chipset, either 4GB or 6GB of RAM (some rumors say it will have 8GB of RAM) and up to 256GB of storage. The trademark dual-camera setup will still be present, along with Android Nougat 7.0 and EMUI 5.0.